Embedded360 has worked on almost all the leading mobile semiconductor platforms to enable ranges of mobile devices - 2.5G, 3G, 3G+, feature phones, smart phones as well as convergent devices. The core chipset expertise is powered by Embedded360's breadth of Mobile OS expertise starting from latest android to brew / BMP, Linux, Nucleus, Symbian/S60, Win Mobile and other proprietary systems. Embedded360' strong Agile methodology based delivery process has helped Embedded360 in supporting OEM customers to manufacture mobile devices on a large scale. But the key differentiator of Embedded360's mobile expertise is to work with the lowest layer of the mobile ecosystem - viz. the semiconductors and Operating Systems.
Services :
Baseband Integration and Validation
BSP and Drivers
BSP integration and customization
Base porting of the OS to the mobile chipsets
Integration of Platform with Licensee Base port
Connectivity drivers like USB, BT, WLAN, FM, A-GPS
Driver and Middleware for MMC/SD, NAND flash, GPIO, Serial port, SDIO, Ethernet etc.
Changes in bootloader, driver development & integration for on-board peripherals
Multimedia Integration and validation with core processor or DSP co-processor
AV Record and playback like MPEG4 / H.263, H.264,WMV
Audio Decoder and encoder with multiple formats (MP3, AAC+, WB-AMR, NB-AMR, WMA)
Speech processing algorithms
Audio power and performance optimization
Graphics SW like OpenGLES
Imaging capture and display
Camera drivers