Coupled with our service offerings in embedded software product engineering, silicon engineering, board design, electronics manufacturing and our focus on the complete product design & engineering and includes in its core capability, the development of mechanical products right from concept design to prototype through a process of CAID/CAD/CAE & CAM, specifically in the areas of automotive, consumer electronics, general engineering and retail.
We have created collaborative environment that enables the transformation of creative intelligence into productive intelligent systems transgressing boundaries of technologies, through a process of continuous improvements to all aspects of our products & services, ensuring value-added deliverables to our client’s project’s and products.
Printed Circuit Assembly (PCA) offers the latest SMT technology & processes,combined with state-of-the-art quality management systems, on a global scale.The company specializes in high volume, high complexity mixed technology by using SMT machines. Our SMT is having capacity to placement like Ball Grid Array(BGA), QFP & connector.
Embedded360 offers assembly & both in-circuit & functional testing from the company’s. All facilities feature state-of the-art equipment with 3D solder volume paste, AOI & X-ray inspection capabilities, complemented by a tight process monitoring.
Our assembly services are complemented by front-end product development capabilities including strong design experience. Our first Motto is QUALITY.
Embedded360 Commitment to quality is evidenced by Continuous improvement of the day-to-day operations in our factory. Embedded360 actively investigates new strategies & quality concepts for evaluation & inclusion into standard quality processes & tools. Standardization of Embedded360 core processes & methodologies, combined with lean manufacturing,promotes total employee involvement & excellence in Manufacturing.
From Pre-design to Post-installation, Embedded360 works closely with customers to provide tailored test engineering & development solutions. To maintain test efficiency, we continually evaluate product test flow & cycle time Optimization, ultimately we can trim costs, reduce downtime & improve yields.
All our products could be designed to comply with these EU directives providing Independent proof of compliance, including component vendor’s conformity self declarations of each component type.
Vendors supplying products to Embedded360 also comply with the requirements of above mentioned, and are responsible for ensuring that their component suppliers also provide proof of conformity.
Our Infrastructure includes:
|Screen Printers – DEK ELAI & MPM||Auto vision system- cognex 5000.
Under stencil cleaner wet/dry.
Stencil standard 29×29 frame size.
Max Board Size: 20″x 16″(508mm x 406mm).
Max Print Area: 18″x 16″(457.2mm x 406.4mm).
|Paste Inspection Cyber Optics Se300||100% 3D Solder Paste Inspection for fine pitch.
3D Height, True Volume and Area Measurements.
|Fuji CP42 & CP 732 E Chip shooters||PCB Size 50mm sq to 356 x 254mm.
0201, 2010, SO 8 & So16.
Accuracy +/- 0.066mm @ 3 sigma
+/- 0.132mm @ 6 sigma.
No. Of Components / Hour – 50,000.
|GSM Precision placer||PCB Size- 16″ x 18″.
BGA down to 0603 component.
Platform Tray Feeder.
Speed – 5,000 CPH.
Accuracy – +0.1mm.
|Reflow Oven – Vitronics Soltec XPM 520 and BTU.||Air/N2 Ready.
Five heating zones.
|In-circuit tester. Concorde make Model T 800 FV||Checks IC Missing and orientation.
Ten highest component failure display.
Auto guarding and Pin number search function.
Self diagnostic function & Loop test.
A fixed voltage generator offers a fast method of charging
the Capacitors and saves time during test.
|HP 5DX X-Ray Inspection Series II machine||Automatic analysis of joints.
High repeatability measurements.
Accurate good/bad decisions.
Display of cross sectional images.
High fault coverage, typically 98% of process defects.
|Air-VAC BGA Rework Station DRS 26||Max. Board Size: 250 x 400 mm.
VISION: 3 in. x 3 in. max. Comp. size.
|Data I/O PP100 Programmers||Flexible and Quality programmer/handler with vision.
High level of quality and reliability.
Up to 600 devices per hour for devices with programming
times less than 80 Seconds with any packaged format.
|AOI-YES Tech||100% inspection of chip & fine pitch components
Throughput up to 5sq .in/sec>component per hour
Minimum component size-0201; 01005 with high