Embedded360 Miniaturization Services utilizes the Large Area Panel (LAP) – based Embedded Die technology to perform sub-system size reduction levels that cannot be achieved via standard chip-on-board technology. Embedded360’s Embedded Die technology offers quality, reliability, security, and allowing practical implementations of systems on a package with real-estate savings of 70% vs the original PCB area.
Design & Realization
- Customer specification generation
- Mechanical and electrical package design
- Circuit Layout and simulation
- Mechanical stress and thermal analysis
With less Less scrap & rework your Product reaches the market in less time.
Prototype to Full Production
- Definition and execution of product validation and verification process
- Product engineering – cradle to grave
- Product realization (components, manufacturing)
- Process and Equipment engineering
- Tooling / fixture design
Test
- Production test system development
- Mixed signal electrical test (Eagle, Syncro, RF Catalyst, Custom Rack & Stack)
- Traceability back to individual silicon wafer number
- Group A,B,C & D qualification testing, X-ray and Cross sectioning
- Burn-in ovens – production and component screening
